The new tubular vacuum sintering furnace is designed for sintering applications for semiconductor and electric rectifying elements requiring vacuum sintering, gas-protective sintering and
conventional sintering processing.
It is a kind of innovative equipment in specific semiconductor facilities with creative design,
easy operation and compact size, which is able to fulfill multiple processing flow
with single device.
It is also applicable for vacuum heat treatment, vacuum braking etc.
It is classified by single, dual and multiple stations.
Technical data of vacuum sintering furnace
Vacuum compartment station: 1~3 stations Working temperature: 200℃~1000℃ Temperature control precision1℃ Length of constant temperature zone1000mm (lengthof constant
temperature zone can be custom defined) Vacuum:.33×10-1Pa~1.33×10-3Pa I.D of working compartment: 350mm (I.D of working compartment can
be custom defined) Working method: automatic, manual
Features of vacuum sintering furnace
Full imported components for key parts with high reliability. Programmable temperature increase/decrease functions Multiple safety protections such as alarming for break-off,
over-temperature and temperature limit are available. High interference-proof capability. Multiple processing pipeline available for flexible configuration
with users.
