Diffusion furnace is a kind of heat processing equipment for wafer
treatment such as diffusion,
oxidization, tempering, alloy and sintering during manufacturing of
semiconductor elements and large-scaled ICs. There are two kinds of
control method: PC control and program control. It comprises of: Heating furnace
body (diffusion furnace body),
purification workstation, feeding system (pushpull system), gas
source system and control system etc.
Key technical data
O.D of configurable process tube:2~8 inchQuantity of configurable process tube:1~4 tubes/set Working temperature range:400～1300℃ Length & precision of constant temp. zone:300～1000mm
600~1300℃±0.5℃ Single point temperature stability:600～13000.5℃/24h Max.
controllable speed of temp. increase:15℃/minMax. controllable speed
oftemp. decrease:5℃/minQingdao SAIRUIDA may provide non-standard products according custom
requirements
Main functions of the system are:
Full simplified Chinese interface with editable parameters for easy
operation.Storing multiple processing curves with multiple steps for each
curve.Automatic control operation for processing curves. Pause/Stop function in auto-operation process. Ability to jump forcibly to the next step operation in processSmart temperature increase/decrease slop control functionPID parameter custom definition
Storing multiple groups of PID parameters for running function call
for the system System malfunction detection & alarm System tolerance correction (single or multiple point dynamic
correction)Smart cantilever push-pull vessel control functionProgram control on process gas (solenoid valve/mass flow
controller)Continuous operation at break point after power-off, etc.
Functions might be added/deducted or developed according to special
demands from customer.
